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Intel CEO confirms that the next generation CPU releases a single TSMC of 3 nanometers

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Intel CEO confirms that the next generation CPU releases 3 nanometers from TSMC. Intel CEO at Gelsinger confirms that the collaboration with TSMC has progressed from a 5-nanometer process to 3 nanometers. Gelsinger stated that the computing chip blocks (CPU tiles) of Arrow Lake and Lunar Lake, which will debut as early as the fourth quarter of 2024, will use TSMC's 3-nanometer process.
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