On October 28th, Intel announced the expansion of its Chengdu packaging and testing base.
According to the official account of "Intel Information", Intel plans to provide more packaging and testing services for server chips on the basis of the existing packaging and testing of client products, and set up a customer solution center to improve the efficiency of the local supply chain, increase support for Chinese customers, and improve the response speed. At present, relevant planning and construction work has been initiated.
According to the expansion plan of Intel's Chengdu base, its new production capacity will be focused on providing packaging and testing services for server chips. The upcoming Intel Customer Solutions Center will become a one-stop platform for driving enterprise digital transformation.
Wang Rui, Senior Vice President of Intel Corporation and Chairman of Intel China, said, "The expansion of the Chengdu base will enable Intel to focus more on local needs, integrate resources, respond more quickly to the digital and green transformation of Chinese customers, and inject new momentum into the sustainable development of the digital economy
The relevant person in charge of Chengdu High tech Zone said, "The Intel Chengdu Base Expansion Project marks Intel's further efforts to build an open ecosystem that serves local enterprises, and is of great significance in promoting the gathering of enterprise ecological partners in Chengdu and promoting high-quality industrial development
Intel began laying out factories in Chengdu in 2003 and has increased capital multiple times. According to Intel's official website, Intel Products (Chengdu) Co., Ltd. is located in the Chengdu High tech Comprehensive Bonded Zone and is currently one of Intel's largest chip packaging and testing centers worldwide. More than half of Intel's global mobile processors and semi-finished chips are produced in Intel Chengdu. At the same time, Intel has also built a wafer pre-processing production line in Chengdu, which is one of Intel's three largest wafer pre-processing factories worldwide.
Red Star News reporter Yu Yao intern reporter Fu Xiaoyin