TSMC releases first outsourcing order for CoWoS packaging front-end: The latest news in the industry is that TSMC has released its first outsourcing order for the key front-end CoW process of CoWoS, which was won by Silicon Semiconductor Manufacturing Co., Ltd. and will establish new production capacity. It is expected to enter production in the second quarter of next year and increase volume in the third quarter. TSMC President David Wei previously revealed that CoWoS production capacity will double this year.