According to reports, Nvidia and AMD have taken over TSMC's advanced packaging capacity for the next two years. AI giants Nvidia and AMD are fully pushing for the high-performance computing (HPC) market, with rumors circulating that they will take over TSMC's advanced packaging capacity for CoWoS and SoIC this and next year. TSMC is highly optimistic about the momentum brought by AI related applications. President Wei Zhejia revised the visibility and revenue ratio of AI orders at the April press conference. Among them, the visibility of orders has been extended from the original expectation of 2027 to 2028. TSMC believes that the contribution of server AI processors to revenue this year will more than double, accounting for the bottom ten percentage of the company's total revenue in 2024. It is expected that the compound annual growth rate of server AI processors will reach 50% in the next five years, and they will account for over 20% of TSMC's revenue in 2028.