Chip Battlefield | TSMC can receive up to $6.6 billion in US government subsidies to build a third wafer factory in the US
大白兔奶糖
发表于 2024-4-10 15:11:44
3490
0
0
Reported by 21st Century Business Herald reporter Ni Yuqing and intern Zhu Ziye from Shenzhen
Recently, TSMC announced that the US Department of Commerce and TSMC Arizona have signed a non binding preliminary memorandum of terms, under the rules of the Chip and Science Act, TSMC will receive up to $6.6 billion in direct subsidies.
Meanwhile, the memorandum proposes to provide up to $5 billion in loans to TSMC, and TSMC also plans to apply for up to 25% investment tax relief from the US Treasury for the eligible portion of TSMC Arizona's capital expenditures. In addition, TSMC announced plans to establish a third wafer fab in TSMC Arizona to meet customer needs.
TSMC stated in its announcement that it will maintain its commitment to long-term financial goals, with a compound annual growth rate of 15% to 20% in US dollars, a gross profit margin of over 53%, and a return on equity of over 25%.
TSMC officially disclosed that the first wafer fab in Arizona, USA will begin production of 4-nanometer process technology in the first half of 2025 according to schedule, and the second wafer fab will adopt 2-nanometer process technology, expected to start production in 2028; The third wafer fab is expected to adopt 2 nanometers or more advanced process technology for chip production by the end of the 2020s.
At the same time, TSMC stated that the plan to establish a third wafer fab will result in TSMC's total capital expenditure at its Phoenix stronghold in Arizona exceeding $65 billion. This will be the largest foreign direct investment case in Arizona's history and also the largest foreign direct investment case in Greenfield in US history.
In recent years, TSMC's production system has continuously expanded overseas. In addition to its three factories in Arizona, USA, TSMC has also established two wafer factories in Kumamoto Prefecture, southern Japan. Last year, TSMC announced an investment of approximately 3.5 billion euros in Dresden, Germany to establish a wafer factory, forming a global layout spanning Europe, America, and Asia.
In the view of industry insiders, in recent years, major regions around the world have been strengthening their local manufacturing capabilities, especially in the competition for manufacturing highlands such as semiconductors. Therefore, countries are recruiting chip giants to build factories.
According to reports, Samsung is also planning to significantly increase its semiconductor investment in Taylor, Texas, USA in the near future. On the basis of the planned investment of $17 billion announced in 2021 to build a 5nm wafer factory, a new advanced process wafer factory, an advanced packaging factory, and a research and development center will be built, bringing the overall investment amount to approximately $44 billion.
The preferential policies in the field of semiconductor manufacturing and research and development in the United States have also continued. Last month, Intel announced that it would receive $8.5 billion in direct subsidies from the US government to promote Intel's semiconductor manufacturing and research and development projects in Arizona, New Mexico, Ohio, and Oregon.
On the other hand, in recent times, the United States has continued to tighten semiconductor export controls and intends to strengthen joint actions among alliances, and the global semiconductor landscape will continue to be influenced by policies.
CandyLake.com 系信息发布平台,仅提供信息存储空间服务。
声明:该文观点仅代表作者本人,本文不代表CandyLake.com立场,且不构成建议,请谨慎对待。
声明:该文观点仅代表作者本人,本文不代表CandyLake.com立场,且不构成建议,请谨慎对待。
猜你喜欢
- Qifu Technology Fei Haojun: Financial technology companies are the first battlefield for the implementation of financial big models
- Yu Chengdong: Good news! Dongchedi seems to be fighting back! Tesla joins the winter testing battlefield and Great Wall Motors proposes testing initiatives
- Although GLP-1 drugs have good weight loss effects, they have become a financial and ethical test for the US government
- The US government is reported to provide billions of dollars in funding to Intel next week
- Chip Battlefield | Qualcomm Releases Third Generation Snapdragon 8s Mobile Platform to Accelerate the Popularization of AI Phones
- TSMC Announces Construction of Third Wafer Factory in the United States: Received $6.6 billion Direct Subsidy and Intends to Apply for 25% Investment Tax Credit
- Kumamoto Prefecture, Japan is preparing to provide "comprehensive support" to attract TSMC to build a third chip factory
- Oracle: The US government's "ban on TikTok" bill will harm our performance
- Top 20 US Stock Transactions: Nvidia Falls Over 6%, US Government Considers Stricter Trade Control Measures
- Can JD.com create a new JD.com by betting on the important battlefield of the next decade?
-
每经AI快讯,据亿航智能官微消息,公司EH216-S无人驾驶电动垂直起降航空器(eVTOL)获得巴西国家民航局颁发的试验飞行许可证书,并计划在巴西进行测试和试飞。关于EH216-S无人驾驶eVTOL在巴西的认证,中国民航局 ...
- 潇湘才子
- 昨天 08:41
- 支持
- 反对
- 回复
- 收藏
-
今年7月,美国三大海外“债主”所持美国国债齐刷刷缩水,其中日本美债持仓已降至去年10月以来最低。 根据美国财政部当地时间9月18日公布的国际资本流动报告(TIC),2024年7月,美国前三大海外“债主”日本 ...
- 520hacker
- 3 天前
- 支持
- 反对
- 回复
- 收藏
-
上证报中国证券网讯(记者俞立严)9月19日,蔚来全新品牌乐道的首款车型——乐道L60正式上市。新车定位家庭智能电动SUV,在采用BaaS电池租用服务后,L60的售价可低至14.99万元,电池租用月费最低为599元。乐道L6 ...
- anhao007
- 前天 11:03
- 支持
- 反对
- 回复
- 收藏
-
每经记者袁园 日前,国务院印发的《关于加强监管防范风险推动保险业高质量发展的若干意见》提出,以新能源汽车商业保险为重点,深化车险综合改革。 “车险综改”从2015年就已经开始逐步推进了,经过 ...
- moshulong
- 前天 21:50
- 支持
- 反对
- 回复
- 收藏